Technical Capabilities
KEY CAPABILITY METRICS
The numbers below represent our standard production capability range. Many parameters can be tightened further for specialised applications — speak to our engineering team for application-specific tolerances.
2"–8"
Wafer diameter range processed
<0.2nm
Surface roughness Ra (epi-ready CMP)
<5µm
Total thickness variation (TTV) target
Class 100
Cleanroom processing environment
FIVE CORE PROCESSING CAPABILITIES
01
Wafer size range — 2 inch to 8 inch
Sapphire and SiC substrates across all standard semiconductor diameters
Wafer Plus processes sapphire and SiC substrates across the full range of standard semiconductor wafer diameters — from 2 inch, the historical standard for blue LED production, through 4 inch and 6 inch mid-range formats, up to 8 inch large-format wafers used in advanced LED and power device manufacturing.
Each diameter requires different wire saw parameters, polishing plate configurations, and handling fixtures. Our equipment portfolio covers all standard sizes without compromising on thickness uniformity or surface quality as diameter scales up. Non-standard sizes between these increments can also be accommodated on request.
02
Low TTV, bow, and warp
Flatness control critical for epitaxial and photolithography processes
Total thickness variation (TTV), bow, and warp are among the most critical geometric parameters for any wafer intended for epitaxial growth or photolithography. Excessive TTV causes non-uniform epitaxial layer thickness; high bow leads to wafer handling failures and chuck contact issues in steppers and MOCVD systems.
Wafer Plus controls these parameters at every stage of the processing sequence — from wire saw cut parameters through grinding plate conditioning and CMP polish time balancing. We measure TTV, bow, and warp on 100% of production wafers using capacitance-based thickness mapping tools, and segregate any wafer that falls outside the agreed specification window before shipment.
03
High surface quality polishing
Sub-nanometre CMP finishing for epi-ready and optical-grade surfaces
Surface quality is the most demanding specification for sapphire and SiC wafers intended for epitaxial growth. The surface must be atomically smooth — free of scratches, pits, sub-surface damage, and polishing residue — to allow epitaxial layers to nucleate uniformly and grow without defect propagation into the device layer.
Our polishing sequence moves through rough lapping, fine lapping, and chemical-mechanical planarisation (CMP) stages, each using dedicated consumables selected for the specific substrate material. Final CMP produces surfaces with Ra roughness below 0.2 nm on sapphire — measurable by AFM — with a scratch-free surface confirmed by Nomarski DIC microscopy at 100% inspection. Double-side polished (DSP) configurations are available for applications requiring both surfaces to optical quality.
04
Cleanroom processing capability
Controlled environment throughout polishing, cleaning, inspection, and packaging
Particle contamination on a wafer surface is one of the most common causes of epitaxial defects and device yield loss. A single sub-micron particle can seed a defect cluster that propagates through multiple device layers and renders an entire region of the wafer unusable. Controlling the particle environment throughout every post-grinding process step is therefore non-negotiable for wafers destined for LED or power semiconductor production.
Wafer Plus performs all polishing, cleaning, metrology, and packaging operations inside a cleanroom-controlled environment. Wafers are handled exclusively with cleanroom-compliant tooling, packaged in nitrogen-purged carriers, and sealed in double-bagged static-shielding pouches prior to shipment. Cleanroom discipline is maintained by all personnel working in the processing areas.
05
Precision inspection and metrology
In-process and final inspection tools that verify every parameter before shipment
A wafer is only as good as the measurement confirming it meets specification. Wafer Plus maintains a suite of in-process and final inspection instruments that provide quantitative, traceable measurements of every critical parameter — geometry, surface quality, crystal orientation, and cleanliness — before any wafer is released for shipment.
Inspection data is recorded for every wafer and included in the shipment documentation as part of our standard certificate of conformance. Customers who require raw measurement data files — AFM scans, thickness maps, orientation reports — can request these as part of their supply agreement. We do not rely on sampling; all production wafers are individually measured against agreed specification limits.